International R&D Cooperations

EV Group, a leading supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, leading supplier of flip chip and die bonding equipment, announce a development agreement in the field of advanced-chip-to-wafer technology (AC2W). The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation.
The unique technology combines Datacon's leading expertise in chip-bonding and key flip-chip bonding technologies with the unique wafer-level know-how from EV Group. It has been developed in a joint R&D project.
The new equipment platform has already been successfully installed at Infineon AG, a major semiconductor device manufacturer.

Flip Chip Bonder System by flip-chip-bonder.net